Drones used in industrial, agricultural, and military applications (infrastructure inspection, precision agriculture, surveillance and defense missions) operate in particularly harsh outdoor conditions. The onboard electronic systems are subjected to constant vibrations generated by the rotors, the risk of impact during hard landings, as well as direct exposure to dust, rain, salt spray, and corrosive chemicals. Historically, the protection of printed circuit boards (PCBs) re

In the field of electronic design, the physical protection of assemblies has historically relied on architectures consisting of an assembled printed circuit board inserted into a rigid external plastic or metal casing. This traditional encapsulation method results in bulky products with a greater final mass and multiplies the mechanical assembly steps. Faced with the demands of extreme miniaturization and optimized power-to-weight ratio, a technological shift is essential: th

Protecting printed circuit boards (PCBs), sensitive sensors, and connectors from environmental hazards presents a technical and logistical challenge for modern electronics manufacturers. When it comes to requirements for waterproofing, electrical insulation, and impact resistance, two methods compete on assembly lines: potting and low-pressure molding (LPM). Historically, epoxy potting has established itself as the standard solution due to its apparent simplicity of initial i