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Comparative analysis: Overmolding, potting, and enclosure for electronic protection
TL;DR: How to choose the best protection for your electronics? When facing harsh environments, three solutions compete to protect your PCBs and components. Here is the core takeaway from our comparative analysis: Low Pressure Molding (LPM): The breakthrough solution. It reduces the final volume by 30% to 50% by eliminating the air gaps found in traditional enclosures. With a production cycle under 60 seconds , it provides full IP67/69K sealing and integrated strain relief.
Feb 26
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