<?xml version="1.0" encoding="UTF-8"?><rss xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:content="http://purl.org/rss/1.0/modules/content/" xmlns:atom="http://www.w3.org/2005/Atom" version="2.0"><channel><title><![CDATA[Fillio]]></title><description><![CDATA[Fillio]]></description><link>https://www.fillio.ca/blog</link><generator>RSS for Node</generator><lastBuildDate>Sat, 04 Apr 2026 14:21:34 GMT</lastBuildDate><atom:link href="https://www.fillio.ca/en/blog-feed.xml" rel="self" type="application/rss+xml"/><item><title><![CDATA[Comparative analysis: Overmolding, potting, and enclosure for electronic protection]]></title><description><![CDATA[TL;DR: How to choose the best protection for your electronics? When facing harsh environments, three solutions compete to protect your PCBs and components. Here is the core takeaway from our comparative analysis: Low Pressure Molding (LPM):  The breakthrough solution. It reduces the final volume by 30% to 50%  by eliminating the air gaps found in traditional enclosures. With a production cycle under 60 seconds , it provides full IP67/69K sealing and integrated strain relief. It is the optimal...]]></description><link>https://www.fillio.ca/en/post/comparative-analysis-overmolding-potting-and-enclosure-for-electronic-protection</link><guid isPermaLink="false">69a0e72311e0caba0029d94e</guid><pubDate>Fri, 27 Feb 2026 00:37:34 GMT</pubDate><enclosure url="https://static.wixstatic.com/media/7976ca_6f272c872d3a4b279c61fbb1b09bf2f1~mv2.png/v1/fit/w_1000,h_768,al_c,q_80/file.png" length="0" type="image/png"/><dc:creator>Sacha Fabien</dc:creator></item><item><title><![CDATA[Analyse comparative : Surmoulage, empotage et mise en boîtier pour la protection d'électronique]]></title><description><![CDATA[TL;DR : Quelle protection pour vos composantes électroniques? Face aux environnements hostiles, trois solutions s'affrontent pour protéger vos PCB et composants. Voici ce qu'il faut retenir de notre analyse comparative : Le surmoulage basse pression (LPM) :  La solution moderne. Il permet de réduire le volume final de 30 à 50 %  en éliminant le vide d'air des boîtiers. Avec un cycle de production de moins de 60 secondes , il offre une étanchéité IP67/69K totale et une protection des PCB et...]]></description><link>https://www.fillio.ca/post/analyse-comparative-surmoulage-empotage-mise-en-boitier-pour-la-protection-electronique</link><guid isPermaLink="false">69a0e2453a2716aeb215c596</guid><pubDate>Fri, 27 Feb 2026 00:35:49 GMT</pubDate><enclosure url="https://static.wixstatic.com/media/7976ca_6f272c872d3a4b279c61fbb1b09bf2f1~mv2.png/v1/fit/w_1000,h_768,al_c,q_80/file.png" length="0" type="image/png"/><dc:creator>Sacha Fabien</dc:creator></item></channel></rss>